The processing technology of targets shall be selected according to material characteristics: melting and rolling process is mostly adopted for metals and alloys such as Al, Cu, Ti and AuSn; hot isostatic pressing (HIP) sintering process is commonly used for refractory materials such as Cr and Nb₂O₅; hot pressing (HP) or vacuum hot pressing (VHP) process is applied to some ceramic targets; while powder metallurgy targets such as ITO mainly adopt cold isostatic pressing plus sintering (CIP+Sintering) process.

After the precision preparation of the target substrate is completed, the target needs to be firmly bonded to the backing plate through a professional bonding process. We will match differentiated bonding methods according to the material combination of the target and the backing plate to ensure that there are no defects at the bonding interface between the two. Since the bonding quality directly determines the thermal conductivity efficiency of the target during the sputtering process and the uniformity and stability of the final coating, high-precision and high-reliability bonding technology is a crucial core link in the entire manufacturing process of sputtering targets.

Technical Team Background:Our technical team mainly comes from South Korea, Japan and Taiwan, China. Each bonding engineer has nearly 20 years of bonding experience, and our bonding technology has been inherited for more than 40 years.

At an early stage, our company successfully developed a process of adding nanoscale metal powders to indium, the main raw material for bonding, to improve the bonding strength and melting point. This makes the products not easy to oxidize and peel off. In October 2015, we successfully achieved a bonding length of 3100mm for rotary targets. Our company is also one of the first companies to successfully develop the 8.5th generation (8.5G) rotary target bonding process. In the same year, the bonding of our large-size ITO ceramic targets (1200mm) obtained BOE certification.